High Speed Ob Chav Qhov Tuag Txheej Tshuab
Main Technical Parameters
Haum Slurry LFPLCO, LMO, tempary.graphite, silicen carhon, cte
Txheej hom Extrusion txheej
Substrate Dav / Substrate Thickness Max: 1400mm / Cu: min4.5umyAL: Min 9um
Cov menyuam nto qhov dav Max: 1600mm
Txheej dav Max: 1400mm
Txheej ceev ≤90m / min
Txheej hnyav qhov tseeb ± 1%
Cua sov txoj kev Hluav taws xob cua sov / chav cua sov / roj cua sov
Main Performance thiab Structure nta:
1.Qhov thaj tsam hluav taws xob ceev thiab tuag tuaj yeem tsim ACLLOSED-VOJ.
2.CCD system nrog kaw-voj tswj kom pom qhov ntev.
3. Muab daim kab xev txiav rau ntawm cov tailings.
4.Ob txheej slurry tuaj yeem coated ntawm tib sab ntawm lub substrate.
5.Ua hauj lwm ua ke nrog MES system thiab managere mote huab controlfor khoom.
Kev soj ntsuam zoo thiab tawm tswv yim:
1.Area density meter nyob rau hauv X / B ray rau kev tshawb pom hauv online.
2.CCD system rau qhov loj me thiab qhov tsis zoo.
3.NG cim inkjet luam ntawv.
4. Kev ntsuas kub ntawm IR ntawm qhov chaw ntawm electrode hauv qhov cub,
5.Qhov loj flowmeter saib hauv online rau qhov ntws, viscosity thiab kub.
6.NMP concentration xyuas rau cathode cub thiab humidity nrhiav kom tau anode cub.
